Solid crystal machine High-speed wire bonders

DB396 automatic loading and unloading high-speed solid crystal machine

Automatic fixation of flat brackets for semiconductors, LEDs, COBs, and ICs: Large-capacity stacking clip feeding and discrete magazine receiving system, which can easily realize multi-machine control by one loading-free box, improve machine production efficiency and reduce labor costs. Loading and

Product overview

DB396 automatic loading and unloading high speed solid crystal machine:
Automatic fixation of flat brackets for semiconductors, LEDs, COBs, and ICs:
Large-capacity stacking clip feeding and discrete magazine receiving system, which can easily realize one-man control and multiple machines without loading cartridges, improve machine production efficiency and reduce labor costs, and the width of the loading and unloading tables and tables can be adjusted. Post-quality inspection function:


basic skills :
Operating System: Windows XP
Operation interface: Chinese interface
Work cycle time: 140msec (fastest).
Positioning accuracy: ± 1mil
Angle accuracy : ± 3 °
Wafer size : 6 mil × 6 mil ~ 100 mil × 100 mil
Support stand: flat LED light, SMD (0603, 0805, 1010), TOP SMD (3014, 020, etc.), 1W high power
Vision System: Accurate and Adjustable Wafer Image Recognition and Positioning System
Power Supply: 220V±10V, 50Hz, 0.9KW
Air source (pressure) : 3 ~ 5Kgf / cm2
Other functions and configuration: Leakage detection / unlimited program storage quantity / LCD color display / built-in vacuum generation system / external uninterruptible power supply system (UPS) (optional)
Post-crystal quality inspection function: glue size detection, wafer distance deviation detection, angle error detection

Dispensing system:
XY adjustable dispensing, constant temperature dispensing arm
Automatic loading and unloading system Stacking clips and discrete magazine receipts
Working box width: 30mm~75mm adjustable

Volume and weight :
Volume (length × width × height): 1050mm × 1100mm × 1500mm
Weight :650 Kg

Solid crystal system:
Solid crystal head: surface suction type
Solid Crystal Arm : 90 ° rotation
Solid crystal strength :20g ~ 200g

Chip XY Workbench :
Maximum travel: 8” × 8” (203 mm × 203mm)
Accuracy : ± 0.3 mil
Retest accuracy : ± 0.2 mil
Chip ring size 6” or 4” (optional)
Thimble stroke: 3mm (highest)

Solid Crystal Workbench :
Maximum XY distance : 4” ×7” (100 mm × 185mm)
Accuracy: ± 0.3 mil
Repeatability : ± 0.2mil

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Address:Henggang Street, Longgang District, Shenzhen Security Community Tai Fook (New Village) Yi Bang Industrial Zone on the 3rd plant

Tel:+86-755-28651309(Shenzhen) +852-31755068(Hongkong)

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